| 器件图 |
型号/料号 |
品牌/制造商 |
类目 |
参数 |
说明 |
 |
AT42QT1010-MAHR |
Microchip |
电容触摸传感器 |
电源电压-最小:1.8 V; 电源电压-最大:5.5 V; 子类别:Sensors; 标准包装数量:3000; 产品类型:Touch Sensors; 工作电源电压:1.8 V to 5.5 V; 湿度敏感性:Yes; 商标:Microchip Technology / Atmel; 端接类型:SMD/SMT; 系列:AT42QT1010; 封装:Reel; 封装:Cut Tape; 最大工作温度:+ 85 C; 最小工作温度:- 40 C; 温度范围:- 40 C to + 85 C; 封装 / 箱体:UDFN-8; 接口类型:I2C; 通道数量:1 Channel; 传感器类型:Button, Slider, Proximity; RoHS:Y; 制造商:Microchip; |
电容触摸传感器 One-Channel Touch Sensor IC |
 |
AT42QT1060-MMUR |
Microchip |
电容触摸传感器 |
电源电压-最小:1.8 V; 电源电压-最大:5.5 V; 子类别:Sensors; 标准包装数量:6000; 产品类型:Touch Sensors; 工作电源电压:1.8 V to 5.5 V; 湿度敏感性:Yes; 商标:Microchip Technology / Atmel; 端接类型:SMD/SMT; 系列:AT42QT1060; 封装:Reel; 封装:Cut Tape; 最大工作温度:+ 85 C; 最小工作温度:- 40 C; 温度范围:- 40 C to + 85 C; 封装 / 箱体:QFN-28; 接口类型:I2C; 通道数量:6 Channel; 传感器类型:Button, Slider, Proximity; RoHS:Y; 制造商:Microchip; |
电容触摸传感器 INTEGRATED-CIRCUIT |
 |
AT42QT1070-MMHR |
Microchip |
电容触摸传感器 |
电源电压-最小:1.8 V; 电源电压-最大:5.5 V; 子类别:Sensors; 标准包装数量:6000; 产品类型:Touch Sensors; 工作电源电压:1.8 V to 5.5 V; 湿度敏感性:Yes; 商标:Microchip Technology / Atmel; 端接类型:SMD/SMT; 系列:AT42QT1070; 封装:Reel; 封装:Cut Tape; 最大工作温度:+ 85 C; 最小工作温度:- 40 C; 温度范围:- 40 C to + 85 C; 封装 / 箱体:VQFN-20; 接口类型:I2C; 通道数量:7 Channel; 传感器类型:Button, Slider, Proximity; RoHS:Y; 制造商:Microchip; |
电容触摸传感器 QTouch 7 Channel Touch Sensor IC |
|
AT42QT1011-MAHR |
Microchip |
电容触摸传感器 |
电源电压-最小:1.8 V; 电源电压-最大:5.5 V; 子类别:Sensors; 标准包装数量:3000; 产品类型:Touch Sensors; 工作电源电压:1.8 V to 5.5 V; 湿度敏感性:Yes; 商标:Microchip Technology / Atmel; 端接类型:SMD/SMT; 系列:AT42QT1011; 封装:Reel; 封装:Cut Tape; 最大工作温度:+ 85 C; 最小工作温度:- 40 C; 温度范围:- 40 C to + 85 C; 封装 / 箱体:UDFN-8; 接口类型:I2C; 通道数量:1 Channel; 传感器类型:Button, Slider, Proximity; RoHS:Y; 制造商:Microchip; |
电容触摸传感器 One-Channel Touch Sensor IC |
|
AT42QT2160-MMUR |
Microchip |
电容触摸传感器 |
电源电压-最小:1.8 V; 电源电压-最大:5.5 V; 子类别:Sensors; 标准包装数量:6000; 产品类型:Touch Sensors; 工作电源电压:1.8 V to 5.5 V; 湿度敏感性:Yes; 商标:Microchip Technology / Atmel; 端接类型:SMD/SMT; 系列:AT42QT2160; 封装:Reel; 封装:Cut Tape; 最大工作温度:+ 85 C; 最小工作温度:- 40 C; 温度范围:- 40 C to + 85 C; 封装 / 箱体:QFN-28; 接口类型:I2C; 通道数量:16 Channel; 传感器类型:Button, Slider, Proximity; RoHS:Y; 制造商:Microchip; |
电容触摸传感器 INTEGRATED-CIRCUIT |
|
AT42QT1012-MAHR |
Microchip |
电容触摸传感器 |
电源电压-最小:1.8 V; 电源电压-最大:5.5 V; 子类别:Sensors; 标准包装数量:3000; 产品类型:Touch Sensors; 工作电源电压:1.8 V to 5.5 V; 湿度敏感性:Yes; 商标:Microchip Technology / Atmel; 端接类型:SMD/SMT; 系列:AT42QT1012; 封装:Reel; 封装:Cut Tape; 最大工作温度:+ 85 C; 最小工作温度:- 40 C; 温度范围:- 40 C to + 85 C; 封装 / 箱体:UDFN-8; 接口类型:I2C; 通道数量:1 Channel; 传感器类型:Button, Slider, Proximity; RoHS:Y; 制造商:Microchip; |
电容触摸传感器 One-Channel Touch Sensor IC |
 |
AT42QT1110-MUR |
Microchip |
电容触摸传感器 |
电源电压-最小:3 V; 电源电压-最大:5.5 V; 子类别:Sensors; 标准包装数量:6000; 产品类型:Touch Sensors; 工作电源电压:3 V to 5.5 V; 湿度敏感性:Yes; 商标:Microchip Technology; 端接类型:SMD/SMT; 系列:AT42QT1110; 封装:Reel; 封装:Cut Tape; 最大工作温度:+ 85 C; 最小工作温度:- 40 C; 温度范围:- 40 C to + 85 C; 封装 / 箱体:QFN-32; 接口类型:SPI; 通道数量:11 Channel; 传感器类型:Button, Slider, Proximity; 制造商:Microchip; |
电容触摸传感器 QTouch 11 Key Touch Sensor IC |
 |
QT113BISG |
Microchip |
电容触摸传感器 |
子类别:Sensors; 标准包装数量:4000; 产品类型:Touch Sensors; 湿度敏感性:Yes; 商标:Microchip Technology / Atmel; RoHS:Y; 制造商:Microchip; |
电容触摸传感器 TOUCH PRODUCTS INTEGRATEDCIRCUIT |
 |
IQS211B-00000000-TSR |
Azoteq |
电容触摸传感器 |
商标名:ProxSense; 电源电压-最小:1.8 V; 电源电压-最大:3.6 V; 子类别:Sensors; 标准包装数量:3000; 产品类型:Touch Sensors; 工作电源电压:1.8 V to 3.6 V; 商标:Azoteq; 端接类型:SMD/SMT; 系列:IQS211x; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 最大工作温度:+ 85 C; 最小工作温度:- 40 C; 封装 / 箱体:TSOT23-6; 接口类型:1-Wire; 通道数量:1 Channel; 传感器类型:Capacitance-to-Digital Converter; RoHS:Y; 制造商:Azoteq; |
电容触摸传感器 Single Channel Capacitive Proximity/Touch Controller with movement detection |
|
IQS231B-00000000-TSR |
Azoteq |
电容触摸传感器 |
商标名:ProxSense; 电源电压-最小:1.75 V; 电源电压-最大:3.6 V; 子类别:Sensors; 标准包装数量:3000; 产品类型:Touch Sensors; 工作电源电压:1.75 V to 3.6 V; 商标:Azoteq; 端接类型:SMD/SMT; 系列:IQS231; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 最大工作温度:+ 85 C; 最小工作温度:- 40 C; 封装 / 箱体:TSOT23-6; 接口类型:I2C; 通道数量:1 Channel; 传感器类型:Capacitance-to-Digital Converter; RoHS:Y; 制造商:Azoteq; |
电容触摸传感器 Single Channel Capacitive Proximity/Touch Controller for SAR applications |
 |
IQS231A-00004000-DNR |
Azoteq |
电容触摸传感器 |
商标名:ProxSense; 电源电压-最小:1.75 V; 电源电压-最大:3.3 V; 子类别:Sensors; 标准包装数量:3000; 产品类型:Touch Sensors; 工作电源电压:1.75 V to 3.3 V; 商标:Azoteq; 宽度:3 mm; 端接类型:SMD/SMT; 系列:IQS231; 长度:3 mm; 高度:0.8 mm; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 最大工作温度:+ 85 C; 最小工作温度:- 20 C; 封装 / 箱体:DFN-10; 接口类型:I2C; 通道数量:1 Channel; 传感器类型:Controller; RoHS:Y; 制造商:Azoteq; |
电容触摸传感器 Cap/Prox Controller for SAR Applications |
 |
IQS211A-00000000-TSR |
Azoteq |
电容触摸传感器 |
商标名:ProxSense; 子类别:Sensors; 标准包装数量:3000; 产品类型:Touch Sensors; 商标:Azoteq; 系列:IQS211x; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; RoHS:Y; 制造商:Azoteq; |
电容触摸传感器 Proximity, Touch, Movement Controller |
 |
804090 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree XP-E; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp XP-E, Star Board (1-up), TCLAD LED IMS Series, IDH 2188494 |
 |
803261 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:10; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Avago Moonstone; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Avago Moonstone Emitter, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2180568 |
 |
804087 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Bulk; 芯体材料:Aluminum; 设计目的:Osram OSLON; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Osram Oslon, Star Board (1-up), TCLAD LED IMS Series, IDH 2188493 |
 |
803128 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Osram Golden Dragon; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Osram Golden Dragon , Star Board (1-up), TCLAD LED IMS Series, IDH 2188432 |
 |
804450 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Cree MX-6; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp MX-6, Star Board (1-up), TCLAD LED IMS Series, 804450-A |
|
804936 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree XM-L; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree X-ML, TCLAD LED IMS Series, IDH 2188554 |
 |
803291 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Nichia Power LED 6.5 x 5; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Nichia Power LED 3.5 x 3.5, Star Board (1-up), TCLAD LED IMS Series, IDH 2188448 |
 |
804155 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Nichia Rigel 3.5 x 3.5; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Nichia Rigel 3.5 x 3.5, Star Board (1-up), TCLAD LED IMS Series, IDH 2188501 |
 |
804511 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree XP-G; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp XP-G, Star Board (1-up), TCLAD LED IMS Series, IDH 2180575 |
|
805245 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree MT-G; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree MTG, Star Board (1-up), TCLAD LED IMS Series, 805245-A |
 |
LZ4-4MCPCB |
LED Engin |
热基质 - MCPCB |
宽度 – 毫米:19.9 mm; 商标名:LuxiGen; 子类别:Thermal Management; 标准包装数量:100; 产品类型:MCPCB - Thermal Substrates; 长度 – 毫米:19.9 mm; 高度 – 毫米:1.7 mm; 商标:LED Engin; 宽度:19.9 mm; 系列:LZ4; 长度:19.9 mm; 高度:1.7 mm; 设计目的:10W Emitter; 配置:Star Board; RoHS:Y; 制造商:LED Engin; |
热基质 - MCPCB Metal Core PCB For LZ4 Series 1-CH |
 |
LZ1-1MCPCB |
LED Engin |
热基质 - MCPCB |
商标名:LuxiGen; 子类别:Thermal Management; 标准包装数量:100; 产品类型:MCPCB - Thermal Substrates; 商标:LED Engin; 系列:LZ1; 设计目的:3W / 5W Emitter; 配置:Star Board; RoHS:Y; 制造商:LED Engin; |
热基质 - MCPCB Metal Core PCB For LZ1 Series |
 |
804092 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:23; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree XP-E; 配置:Square Strip; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp XP-E, Square Strip (17-up), TCLAD LED IMS Series, IDH 2188496 |
|
803288 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:23; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Bulk; 芯体材料:Aluminum; 设计目的:Osram Golden Dragon; 配置:Square Strip; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Osram Golden Dragon , Square Strip (17-up), TCLAD LED IMS Series |
 |
803268 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:20; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Bulk; 芯体材料:Aluminum; 设计目的:Osram Golden Dragon; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Osram Golden Dragon , Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2165657 |
 |
803265 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:10; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Bulk; 芯体材料:Aluminum; 设计目的:Luxeon I III & V; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Lumileds Luxeon I, III and V, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2188442 |
 |
803269 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:10; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Seoul P4; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Seoul Semiconductor Z-Power, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2213562 |
 |
803808 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Osram OSTAR SMT; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Osram Ostar SMT, Star Board (1-up), TCLAD LED IMS Series, IDH 2188479 |
 |
803122 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Cree XR-E; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp , Star Board (1-up), TCLAD LED IMS Series, 803122-A |
 |
803127 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Luxeon Rebel; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Lumileds Luxeon Rebel, Star Board (1-up), TCLAD LED IMS Series, IDH 2188431 |
 |
803262 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:20; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Bulk; 芯体材料:Aluminum; 设计目的:Cree XR-E; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp , Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2188440 |
 |
803267 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:20; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Bulk; 芯体材料:Aluminum; 设计目的:Luxeon Rebel; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Lumileds Luxeon Rebel, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2188443 |
 |
803129 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Seoul P4; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Seoul Semiconductor Z-Power, Star Board (1-up), TCLAD LED IMS Series |
 |
803123 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Lite-On LOPL; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Lite-On LOPL, Star Board (1-up), TCLAD LED IMS Series |
 |
803790 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:10; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree MC-E; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp MC-E, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2165660 |
 |
803121 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:3971; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 封装:Tray; 芯体材料:Aluminum; 设计目的:Avago Moonstone; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Avago Moonstone Emitter, Star Board (1-up), TCLAD LED IMS Series, IDH 2188427 |
|
804091 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:10; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Cree XP-E; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Cree XLamp XP-E, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series, IDH 2188495 |
 |
804068 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:500; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Samsung Sunnix; 配置:Star Board; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Samsung Sunnix, Star Board (1-up), TCLAD LED IMS Series, 804068-A |
|
803293 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:23; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Nichia Power LED 6.5 x 5; 配置:Square Strip; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Nichia Power LED 3.5 x 3.5, Square Strip (17-up), TCLAD LED IMS Series |
|
803263 |
Bergquist Company |
热基质 - MCPCB |
商标名:TCLAD; 导热性:1.3 W/m-K; 子类别:Thermal Management; 标准包装数量:10; 产品类型:MCPCB - Thermal Substrates; 商标:Bergquist Company; 系列:LED IMS; 芯体材料:Aluminum; 设计目的:Lite-On LOPL; 配置:Star Array; RoHS:Y; 制造商:Bergquist Company; |
热基质 - MCPCB Thermal Clad Power LED IMS Substrate, Footprint = Lite-On LOPL, Star Array (36-up), 1 Piece = 1 Array Panel of 36 Stars, TCLAD LED IMS Series |
 |
B-G474E-DPOW1 |
STMicroelectronics |
LED 照明开发工具 |
商标名:STM32; 子类别:Development Tools; 标准包装数量:1; 产品类型:LED Lighting Development Tools; 商标:STMicroelectronics; 封装:Bulk; 核心:ARM Cortex M4; 用于:STM32G474RE; 产品:Development Kits; RoHS:Y; 制造商:STMicroelectronics; |
LED 照明开发工具 16/32-BITS MICROS |
 |
AEKD-AFLLIGHT1 |
STMicroelectronics |
LED 照明开发工具 |
子类别:Development Tools; 产品类型:LED Lighting Development Tools; 商标:STMicroelectronics; 封装:Bulk; 工作电源电压:12 V; 用于:AFL Systems; 产品:Evaluation Boards; RoHS:Y; 制造商:STMicroelectronics; |
LED 照明开发工具 Loads for Adaptive Front Lighting (AFL) system with LED lights, motors and cooling fan |
 |
LP8866EVM |
Texas Instruments |
LED 照明开发工具 |
子类别:Development Tools; 标准包装数量:1; 产品类型:LED Lighting Development Tools; 商标:Texas Instruments; 系列:LP8866; 工作电源电压:24 V; 用于:LP8866-Q1; 产品:Evaluation Modules; 制造商:Texas Instruments; |
LED 照明开发工具 |
 |
AEKD-AFLPANEL1 |
STMicroelectronics |
LED 照明开发工具 |
子类别:Development Tools; 产品类型:LED Lighting Development Tools; 商标:STMicroelectronics; 封装:Bulk; 工作电源电压:12 V; 核心:SPC5 Chrorus; 用于:AFL Systems; 产品:Test Kits; RoHS:Y; 制造商:STMicroelectronics; |
LED 照明开发工具 Adaptive Front Light testing and prototyping kit arranged on plexiglass panel |
 |
AEK-LED-21DISM1 |
STMicroelectronics |
LED 照明开发工具 |
子类别:Development Tools; 标准包装数量:1; 产品类型:LED Lighting Development Tools; 商标:STMicroelectronics; 输出电流:1.69 A; 封装:Bulk; 工作电源电压:5.5 V to 24 V; 用于:L99LD21; 产品:Driver Kits; RoHS:Y; 制造商:STMicroelectronics; |
LED 照明开发工具 Digitally controlled LED driver board for automotive lighting applications |
 |
AEK-CON-AFLVIP2 |
STMicroelectronics |
LED 照明开发工具 |
子类别:Development Tools; 标准包装数量:1; 产品类型:LED Lighting Development Tools; 商标:STMicroelectronics; 封装:Bulk; 工作电源电压:8 V to 15 V; 用于:AEK-MCU-C4MLIT1, AEK-MOT-SM81M1, AEK-LED-21DISM1; 产品:Evaluation Boards; RoHS:Y; 制造商:STMicroelectronics; |
LED 照明开发工具 Adaptive front lighting connector board with VIPower board slot |
 |
LIGHTING-1-GEVK |
ON Semiconductor |
LED 照明开发工具 |
子类别:Development Tools; 标准包装数量:1; 产品类型:LED Lighting Development Tools; 商标:ON Semiconductor; 封装:Bulk; 用于:ES1JFL, ES3D, FCPF400N80Z, FDC3535, FDD10N20LZTM, FL7740MX, FL7760BM6X, GBU6K, MM3Z18VT1G, MMSZ22T1G, MMSZ4V3T1G, NCH-RSL10-101S51-ACG, NCP10671BD100R2G, NCP161ASN330T1G, NSBC114EPDXV6T1G, RURP1560-F085, US1MFA; 产品:Development Kits; RoHS:Y; 制造商:ON Semiconductor; |
LED 照明开发工具 LIGHTING KIT CONSISTING O |
 |
STEVAL-LLL006V1 |
STMicroelectronics |
LED 照明开发工具 |
子类别:Development Tools; 标准包装数量:1; 产品类型:LED Lighting Development Tools; 商标:STMicroelectronics; 输出电流:700 mA; 封装:Bulk; 工作电源电压:90 VAC to 300 VAC; 用于:HVLED001A; 产品:Evaluation Boards; RoHS:Y; 制造商:STMicroelectronics; |
LED 照明开发工具 Smart LED driver using 6LoWPAN Mesh network for outdoor street lighting |
QQ客服
