| 器件图 |
型号/料号 |
品牌/制造商 |
类目 |
参数 |
说明 |
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3180299353 |
Cinch Connectivity Solutions |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 产品类型:Board to Board & Mezzanine Connectors; 商标:CIN::APSE / Cinch Connectivity Solutions; 位置数量:25 Position; 产品:Headers; RoHS:Y; 制造商:Cinch Connectivity Solutions; |
板对板与夹层连接器 Stck Conn Hdwr 25P tall PCB stackup |
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3180299356 |
Cinch Connectivity Solutions |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 产品类型:Board to Board & Mezzanine Connectors; 商标:CIN::APSE / Cinch Connectivity Solutions; 位置数量:51 Position; 产品:Headers; RoHS:Y; 制造商:Cinch Connectivity Solutions; |
板对板与夹层连接器 Stck Conn Hdwr 51P tall PCB stackup |
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RZ100-210-115-1000 |
AirBorn |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1; 产品类型:Board to Board & Mezzanine Connectors; 安装风格:Mounting Flange; 可燃性等级:UL 94 V-0; 商标:AirBorn; 系列:RZ; 外壳材料:Polyphenylene Sulfide (PPS); 触点材料:Beryllium Copper; 触点电镀:Gold; 最大工作温度:+ 125 C; 最小工作温度:- 65 C; 电压额定值:250 V; 电流额定值:500 mA; 安装角:Straight; 端接类型:Compression; 排数:2 Row; 节距:1.27 mm; 位置数量:20 Position; 产品:Connectors; RoHS:Y; 制造商:AirBorn; |
板对板与夹层连接器 Low Profile High-Density One Piece Interposer Compression Connector |
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RZ150-210-115-1000 |
AirBorn |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1; 产品类型:Board to Board & Mezzanine Connectors; 安装风格:Mounting Flange; 可燃性等级:UL 94 V-0; 商标:AirBorn; 系列:RZ; 外壳材料:Polyphenylene Sulfide (PPS); 触点材料:Beryllium Copper; 触点电镀:Gold; 最大工作温度:+ 125 C; 最小工作温度:- 65 C; 电压额定值:250 V; 电流额定值:500 mA; 安装角:Straight; 端接类型:Compression; 排数:2 Row; 节距:1.27 mm; 位置数量:20 Position; 产品:Connectors; RoHS:Y; 制造商:AirBorn; |
板对板与夹层连接器 Low Profile High-Density One Piece Interposer Compression Connector |
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RZ100-210-115-2000 |
AirBorn |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1; 产品类型:Board to Board & Mezzanine Connectors; 安装风格:Mounting Flange; 可燃性等级:UL 94 V-0; 商标:AirBorn; 系列:RZ; 外壳材料:Polyphenylene Sulfide (PPS); 触点材料:Beryllium Copper; 触点电镀:Gold; 最大工作温度:+ 125 C; 最小工作温度:- 65 C; 电压额定值:250 V; 电流额定值:500 mA; 安装角:Straight; 端接类型:Compression; 排数:2 Row; 节距:1.27 mm; 位置数量:20 Position; 产品:Connectors; RoHS:Y; 制造商:AirBorn; |
板对板与夹层连接器 Low Profile High-Density One Piece Interposer Compression Connector |
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RZ200-210-115-1000 |
AirBorn |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1; 产品类型:Board to Board & Mezzanine Connectors; 安装风格:Mounting Flange; 可燃性等级:UL 94 V-0; 商标:AirBorn; 系列:RZ; 外壳材料:Polyphenylene Sulfide (PPS); 触点材料:Beryllium Copper; 触点电镀:Gold; 最大工作温度:+ 125 C; 最小工作温度:- 65 C; 电压额定值:250 V; 电流额定值:500 mA; 安装角:Straight; 端接类型:Compression; 排数:2 Row; 节距:1.27 mm; 位置数量:20 Position; 产品:Connectors; RoHS:Y; 制造商:AirBorn; |
板对板与夹层连接器 Low Profile High-Density One Piece Interposer Compression Connector |
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RZ100-310-115-1000 |
AirBorn |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1; 产品类型:Board to Board & Mezzanine Connectors; 安装风格:Mounting Flange; 可燃性等级:UL 94 V-0; 商标:AirBorn; 系列:RZ; 外壳材料:Polyphenylene Sulfide (PPS); 触点材料:Beryllium Copper; 触点电镀:Gold; 最大工作温度:+ 125 C; 最小工作温度:- 65 C; 电压额定值:250 V; 电流额定值:500 mA; 安装角:Straight; 端接类型:Compression; 排数:3 Row; 节距:1.27 mm; 位置数量:30 Position; 产品:Connectors; RoHS:Y; 制造商:AirBorn; |
板对板与夹层连接器 Low Profile High-Density One Piece Interposer Compression Connector |
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RZ100-310-115-2000 |
AirBorn |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1; 产品类型:Board to Board & Mezzanine Connectors; 安装风格:Mounting Flange; 可燃性等级:UL 94 V-0; 商标:AirBorn; 系列:RZ; 外壳材料:Polyphenylene Sulfide (PPS); 触点材料:Beryllium Copper; 触点电镀:Gold; 最大工作温度:+ 125 C; 最小工作温度:- 65 C; 电压额定值:250 V; 电流额定值:500 mA; 安装角:Straight; 端接类型:Compression; 排数:3 Row; 节距:1.27 mm; 位置数量:30 Position; 产品:Connectors; RoHS:Y; 制造商:AirBorn; |
板对板与夹层连接器 Low Profile High-Density One Piece Interposer Compression Connector |
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RZ200-310-115-2000 |
AirBorn |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1; 产品类型:Board to Board & Mezzanine Connectors; 安装风格:Mounting Flange; 可燃性等级:UL 94 V-0; 商标:AirBorn; 系列:RZ; 外壳材料:Polyphenylene Sulfide (PPS); 触点材料:Beryllium Copper; 触点电镀:Gold; 最大工作温度:+ 125 C; 最小工作温度:- 65 C; 电压额定值:250 V; 电流额定值:500 mA; 安装角:Straight; 端接类型:Compression; 排数:3 Row; 节距:1.27 mm; 位置数量:30 Position; 产品:Connectors; RoHS:Y; 制造商:AirBorn; |
板对板与夹层连接器 Low Profile High-Density One Piece Interposer Compression Connector |
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RZ250-210-115-1000 |
AirBorn |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1; 产品类型:Board to Board & Mezzanine Connectors; 安装风格:Mounting Flange; 可燃性等级:UL 94 V-0; 商标:AirBorn; 系列:RZ; 外壳材料:Polyphenylene Sulfide (PPS); 触点材料:Beryllium Copper; 触点电镀:Gold; 最大工作温度:+ 125 C; 最小工作温度:- 65 C; 电压额定值:250 V; 电流额定值:500 mA; 安装角:Straight; 端接类型:Compression; 排数:2 Row; 节距:1.27 mm; 位置数量:20 Position; 产品:Connectors; RoHS:Y; 制造商:AirBorn; |
板对板与夹层连接器 Low Profile High-Density One Piece Interposer Compression Connector |
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AXK680347YG |
Panasonic |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1500; 产品类型:Board to Board & Mezzanine Connectors; 商标:Panasonic Industrial Devices; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:P5K; 外壳材料:Resin; 触点材料:Copper Alloy; 触点电镀:Gold; 电压额定值:60 V; 电流额定值:500 mA; 安装角:Vertical; 端接类型:SMD/SMT; 节距:0.5 mm; 位置数量:80 Position; 产品:Headers; RoHS:E; 制造商:Panasonic; |
板对板与夹层连接器 CONN HEADER BRD/BRD 80 POS 0.5mm |
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AXK6F80347YG |
Panasonic |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:2000; 产品类型:Board to Board & Mezzanine Connectors; 商标:Panasonic Industrial Devices; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:P5KF; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:Gold; 电压额定值:60 V; 电流额定值:500 mA; 安装角:Vertical; 端接类型:SMD/SMT; 节距:0.5 mm; 位置数量:80 Position; 产品:Headers; RoHS:E; 制造商:Panasonic; |
板对板与夹层连接器 CONN HEADER BRD/BRD 80 POS 0.5mm |
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91911-31121LF |
FCI / Amphenol |
板对板与夹层连接器 |
商标名:Conan; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:800; 产品类型:Board to Board & Mezzanine Connectors; 商标:Amphenol FCI; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:CONAN; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:GXT; 最大工作温度:+ 130 C; 最小工作温度:- 55 C; 电压额定值:500 V; 电流额定值:1 A; 叠放高度:4.15 mm; 端接类型:SMD/SMT; 节距:1.00 mm; 位置数量:21 Position; 产品:Headers; 制造商:FCI / Amphenol; |
板对板与夹层连接器 CONAN STR SMT HDR W/PEGS |
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FX6-40S-0.8SV(71) |
Hirose Electric |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1; 产品类型:Board to Board & Mezzanine Connectors; 商标:Hirose Connector; 封装:Tube; 系列:FX6; 外壳材料:Polyphenylene Sulfide (PPS); 触点材料:Phosphor Bronze; 触点电镀:Gold; 电压额定值:100 V; 电流额定值:500 mA; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.8 mm; 位置数量:40 Position; 产品:Receptacles; RoHS:Y; 制造商:Hirose Electric; |
板对板与夹层连接器 RCP 40 POS 0.8mm Solder ST SMD Stick |
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54722-0504 |
Molex |
板对板与夹层连接器 |
商标名:SlimStack; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:3000; 产品类型:Board to Board & Mezzanine Connectors; 商标:Molex; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:54722; 外壳材料:Thermoplastic; 触点材料:Gold; 触点电镀:Gold; 最大工作温度:+ 105 C; 最小工作温度:- 40 C; 电压额定值:50 V; 电流额定值:500 mA; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.5 mm; 位置数量:50 Position; RoHS:Y; 制造商:Molex; |
板对板与夹层连接器 0.5mm BTB SMT REC 50P 1.5MM HEIGHT |
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55909-0474 |
Molex |
板对板与夹层连接器 |
商标名:SlimStack; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:2500; 产品类型:Board to Board & Mezzanine Connectors; 商标:Molex; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:55909; 外壳材料:Thermoplastic; 触点材料:Gold; 触点电镀:Gold; 最大工作温度:+ 85 C; 最小工作温度:- 25 C; 电压额定值:50 VAC/DC; 电流额定值:300 mA; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.4 mm; 位置数量:40 Position; 产品:Receptacles; RoHS:Y; 制造商:Molex; |
板对板与夹层连接器 40 Ckt Plug J-leads & solder tab |
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5177986-1 |
TE Connectivity |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:900; 产品类型:Board to Board & Mezzanine Connectors; 商标:TE Connectivity; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:1 mm Free Height; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:Gold; 电压额定值:100 V; 电流额定值:500 mA; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.8 mm; 位置数量:40 Position; 产品:Plugs; RoHS:Y; 制造商:TE Connectivity; |
板对板与夹层连接器 0.8MM-05H PLG 2X020P |
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91930-21125LF |
FCI / Amphenol |
板对板与夹层连接器 |
商标名:Conan; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:35; 产品类型:Board to Board & Mezzanine Connectors; 商标:Amphenol FCI; 封装:Tube; 系列:CONAN; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:GXT; 最大工作温度:+ 130 C; 最小工作温度:- 55 C; 电压额定值:500 V; 电流额定值:1 A; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:1.00 mm; 位置数量:25 Position; 产品:Receptacles; RoHS:Y; 制造商:FCI / Amphenol; |
板对板与夹层连接器 25POS VERT RECPT |
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AXK640347YG |
Panasonic |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1500; 产品类型:Board to Board & Mezzanine Connectors; 商标:Panasonic Industrial Devices; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:P5K; 外壳材料:Resin; 触点材料:Copper Alloy; 触点电镀:Gold; 电压额定值:60 V; 电流额定值:500 mA; 叠放高度:3 mm; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.5 mm; 位置数量:40 Position; 产品:Headers; RoHS:E; 制造商:Panasonic; |
板对板与夹层连接器 CONN HEADER P5K 40 POS 0.5mm |
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8-1734516-0 |
TE Connectivity |
板对板与夹层连接器 |
商标名:AMPMODU; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:900; 产品类型:Board to Board & Mezzanine Connectors; 商标:TE Connectivity; 封装:Reel; 封装:Cut Tape; 系列:2 mm AMPMODU; 外壳材料:Thermoplastic (TP); 触点材料:Brass; 触点电镀:Gold; 电压额定值:250 V; 电流额定值:1 A; 叠放高度:4.5 mm; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:2 mm; 位置数量:30 Position; 产品:Receptacles; RoHS:Y; 制造商:TE Connectivity; |
板对板与夹层连接器 RCPT 2MM 30P VRT SMT 30AU" W/O LOCK |
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AXK540147YG |
Panasonic |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1500; 产品类型:Board to Board & Mezzanine Connectors; 商标:Panasonic Industrial Devices; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:P5K; 外壳材料:Resin; 触点材料:Copper Alloy; 触点电镀:Gold; 电压额定值:60 V; 电流额定值:500 mA; 叠放高度:3 mm; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.5 mm; 位置数量:40 Position; 产品:Receptacles; RoHS:E; 制造商:Panasonic; |
板对板与夹层连接器 CONN SOCKET P5K 40 POS 0.5mm |
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2-5177986-1 |
TE Connectivity |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:700; 产品类型:Board to Board & Mezzanine Connectors; 商标:TE Connectivity; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:1 mm Free Height; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:Gold; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.8 mm; 位置数量:40 Position; 产品:Plugs; RoHS:Y; 制造商:TE Connectivity; |
板对板与夹层连接器 0.8MM-07H PLG 2X020P |
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5-104071-3 |
TE Connectivity |
板对板与夹层连接器 |
商标名:AMPMODU; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:21; 产品类型:Board to Board & Mezzanine Connectors; 安装风格:-; 商标:TE Connectivity; 封装:Tube; 系列:AMPMODU System 50; 触点材料:Phosphor Bronze; 触点电镀:Gold; 电压额定值:30 VAC; 安装角:Straight; 端接类型:Through Hole; 排数:1 Row; 节距:1.27 mm; 位置数量:15 Position; 产品:Headers; RoHS:Y; 制造商:TE Connectivity; |
板对板与夹层连接器 15 POS HDR VERT SINGLE ROW |
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5-104746-2 |
TE Connectivity |
板对板与夹层连接器 |
商标名:AMPMODU; 端接柱长度:3.45 mm; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:90; 产品类型:Board to Board & Mezzanine Connectors; 安装风格:PCB Mount; 可燃性等级:UL 94 V-0; 商标:TE Connectivity / AMP; 应用:Wire to Board; 附件类型:-; 封装:Tray; 系列:AMPMODU System 50; 外壳材料:Thermoplastic; 触点材料:Copper Alloy; 触点电镀:Tin; 最大工作温度:+ 105 C; 最小工作温度:- 65 C; 电压额定值:30 V; 安装角:Right Angle; 端接类型:Through Hole; 排数:2 Row; 节距:1.27 mm; 位置数量:22 Position; 产品:Headers; RoHS:Y; 制造商:TE Connectivity; |
板对板与夹层连接器 22 SYS 50 HDR DRRA UNSHRD SN |
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8-188275-8 |
TE Connectivity |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:900; 产品类型:Board to Board & Mezzanine Connectors; 商标:TE Connectivity / AMP; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:Micro-MaTch; 外壳材料:Polyamide (PA); 触点材料:Phosphor Bronze; 触点电镀:Tin; 安装角:Vertical; 端接类型:SMD/SMT; 位置数量:18 Position; 产品:Plugs; RoHS:Y; 制造商:TE Connectivity; |
板对板与夹层连接器 FOB 18P TOP ENTRY SMT |
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5-5179180-1 |
TE Connectivity |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:500; 产品类型:Board to Board & Mezzanine Connectors; 商标:TE Connectivity; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:1 mm Free Height; 节距:0.8 mm; 位置数量:40 Position; 产品:Receptacles; RoHS:Y; 制造商:TE Connectivity; |
板对板与夹层连接器 0.8MM-09H REC 2X020P |
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52465-4071 |
Molex |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1000; 产品类型:Board to Board & Mezzanine Connectors; 商标:Molex; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:52465; 外壳材料:Thermoplastic; 触点材料:Tin; 触点电镀:Tin; 最大工作温度:+ 105 C; 最小工作温度:- 40 C; 电压额定值:50 V; 电流额定值:500 mA; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.8 mm; 位置数量:40 Position; 产品:Receptacles; RoHS:Y; 制造商:Molex; |
板对板与夹层连接器 0.8 BtB Hsg Assy SMT SMT 40Ckt EmbsTp Pkg |
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5-5179010-1 |
TE Connectivity |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1100; 产品类型:Board to Board & Mezzanine Connectors; 商标:TE Connectivity; 封装:Bulk; 系列:1 mm Free Height; 外壳材料:Thermoplastic (TP); 触点材料:Beryllium Copper; 触点电镀:Gold; 电压额定值:100 V; 电流额定值:500 mA; 叠放高度:13 mm to 16 mm; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.8 mm; 位置数量:40 Position; 产品:Receptacles; RoHS:Y; 制造商:TE Connectivity; |
板对板与夹层连接器 40P 13mm RECEPTACLE STACK HEIGHT 13-16mm |
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AXE650124 |
Panasonic |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:5000; 产品类型:Board to Board & Mezzanine Connectors; 绝缘电阻:1 GOhms; 安装风格:SMD; 可燃性等级:UL 94 V-0; 商标:Panasonic Industrial Devices; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:A4S; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:Gold; 最大工作温度:+ 85 C; 最小工作温度:- 55 C; 电压额定值:60 V; 电流额定值:300 mA; 叠放高度:0.8 mm; 安装角:Straight; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.4 mm; 位置数量:50 Position; 产品:Headers; RoHS:Y; 制造商:Panasonic; |
板对板与夹层连接器 Header 0.4mm,50-pin w/o positioning boss |
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91911-31451LF |
FCI / Amphenol |
板对板与夹层连接器 |
商标名:Conan; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:500; 产品类型:Board to Board & Mezzanine Connectors; 商标:Amphenol FCI; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:CONAN; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:GXT; 最大工作温度:+ 130 C; 最小工作温度:- 55 C; 电压额定值:500 V; 电流额定值:1 A; 叠放高度:6 mm; 端接类型:SMD/SMT; 节距:1.00 mm; 位置数量:51 Position; 产品:Headers; RoHS:Y; 制造商:FCI / Amphenol; |
板对板与夹层连接器 CONAN 4HT HDR |
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53353-1071 |
Molex |
板对板与夹层连接器 |
商标名:SlimStack; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1000; 产品类型:Board to Board & Mezzanine Connectors; 可燃性等级:UL 94 V-0; 商标:Molex; 应用:Signal, Board to Board; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:53353; 外壳材料:Thermoplastic; 触点材料:Tin; 触点电镀:Tin; 最大工作温度:+ 105 C; 最小工作温度:- 40 C; 电压额定值:50 V; 电流额定值:500 mA; 叠放高度:7 mm; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.8 mm; 位置数量:10 Position; 产品:Headers; RoHS:Y; 制造商:Molex; |
板对板与夹层连接器 0.8 BtB Wafer Assy S T SMT 10CktEmbsTpPkg |
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1-5176837-8 |
TE Connectivity |
板对板与夹层连接器 |
商标名:AMPMODU; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:16; 产品类型:Board to Board & Mezzanine Connectors; 安装风格:-; 商标:TE Connectivity / AMP; 系列:2 mm AMPMODU; 触点材料:Brass; 触点电镀:Gold; 电压额定值:200 VAC; 电流额定值:1 A; 安装角:Right Angle; 端接类型:Through Hole; 排数:2 Row; 节距:2 mm; 位置数量:38 Position; 产品:Headers; RoHS:Y; 制造商:TE Connectivity; |
板对板与夹层连接器 38 AMPMODU 2MM, H AU, LF |
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15150202601000 |
HARTING |
板对板与夹层连接器 |
商标名:har-flex; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:560; 产品类型:Board to Board & Mezzanine Connectors; 商标:HARTING; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 电流额定值:1.7 A; 安装角:Right Angle; 端接类型:SMD/SMT; 排数:2 Row; 节距:1.27 mm; 位置数量:20 Position; 产品:Headers; RoHS:Y; 制造商:HARTING; |
板对板与夹层连接器 HAR-FLEX R/A MALE 20P |
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FX8-60S-SV |
Hirose Electric |
板对板与夹层连接器 |
商标名:FunctionMAX; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1; 产品类型:Board to Board & Mezzanine Connectors; 绝缘电阻:1000 MOhms; 商标:Hirose Connector; 封装:Tray; 系列:FX8; 外壳材料:Polyphenylene Sulfide (PPS); 触点材料:Phosphor Bronze; 触点电镀:Gold; 最大工作温度:+ 85 C; 最小工作温度:- 55 C; 电压额定值:100 V; 电流额定值:400 mA; 安装角:Straight; 端接类型:SMD/SMT; 节距:0.6 mm; 位置数量:60 Position; 产品:Receptacles; RoHS:Y; 制造商:Hirose Electric; |
板对板与夹层连接器 RCP 60 POS 0.6mm Solder ST SMD Tray |
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91910-21131LF |
FCI / Amphenol |
板对板与夹层连接器 |
商标名:Conan; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:29; 产品类型:Board to Board & Mezzanine Connectors; 商标:Amphenol FCI; 封装:Tube; 系列:CONAN; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:GXT; 最大工作温度:+ 130 C; 最小工作温度:- 55 C; 电压额定值:500 V; 电流额定值:1 A; 叠放高度:4.15 mm; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:1.00 mm; 位置数量:31 Position; 产品:Headers; RoHS:Y; 制造商:FCI / Amphenol; |
板对板与夹层连接器 31POS VERT PLUG |
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15250162601000 |
HARTING |
板对板与夹层连接器 |
商标名:har-flex; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:560; 产品类型:Board to Board & Mezzanine Connectors; 商标:HARTING; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 电流额定值:1.7 A; 安装角:Right Angle; 端接类型:SMD/SMT; 排数:2 Row; 节距:1.27 mm; 位置数量:16 Position; 产品:Receptacles; RoHS:Y; 制造商:HARTING; |
板对板与夹层连接器 HAR-FLEX R/A FEMALE 16P |
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500913-0902 |
Molex |
板对板与夹层连接器 |
商标名:SlimStack; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1500; 产品类型:Board to Board & Mezzanine Connectors; 商标:Molex; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:500913; 外壳材料:Thermoplastic; 触点材料:Gold; 触点电镀:Gold; 最大工作温度:+ 85 C; 最小工作温度:- 25 C; 电压额定值:50 VAC/DC; 电流额定值:300 mA; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.4 mm; 位置数量:90 Position; 产品:Receptacles; RoHS:Y; 制造商:Molex; |
板对板与夹层连接器 0.4 BtB Rec Hsg Assy 90Ckt |
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FX20-40S-0.5SH |
Hirose Electric |
板对板与夹层连接器 |
商标名:FunctionMAX; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1; 产品类型:Board to Board & Mezzanine Connectors; 商标:Hirose Connector; 封装:Tray; 系列:FX20; RoHS:Y; 制造商:Hirose Electric; |
板对板与夹层连接器 |
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91930-21131LF |
FCI / Amphenol |
板对板与夹层连接器 |
商标名:Conan; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:29; 产品类型:Board to Board & Mezzanine Connectors; 商标:Amphenol FCI; 封装:Tube; 系列:CONAN; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:GXT; 最大工作温度:+ 130 C; 最小工作温度:- 55 C; 电压额定值:500 V; 电流额定值:1 A; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:1.00 mm; 位置数量:31 Position; 产品:Receptacles; RoHS:Y; 制造商:FCI / Amphenol; |
板对板与夹层连接器 31P SMD VERT RECEPT |
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10106813-074112LF |
FCI / Amphenol |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:800; 产品类型:Board to Board & Mezzanine Connectors; 绝缘电阻:1000 MOhms; 商标:Amphenol FCI; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:MezzoStak; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:GXT; 最大工作温度:+ 125 C; 最小工作温度:- 40 C; 电压额定值:500 V; 电流额定值:500 mA; 叠放高度:7 mm; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.50 mm; 位置数量:70 Position; 产品:Hermaphroditic Connectors; RoHS:Y; 制造商:FCI / Amphenol; |
板对板与夹层连接器 70P MEZZANINE 3.5MM HERMAPHRODITIC |
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91930-21111LF |
FCI / Amphenol |
板对板与夹层连接器 |
商标名:Conan; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:59; 产品类型:Board to Board & Mezzanine Connectors; 商标:Amphenol FCI; 封装:Tube; 系列:CONAN; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:GXT; 最大工作温度:+ 130 C; 最小工作温度:- 55 C; 电压额定值:500 V; 电流额定值:1 A; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:1.00 mm; 位置数量:11 Position; 产品:Receptacles; RoHS:Y; 制造商:FCI / Amphenol; |
板对板与夹层连接器 SMT RECEPTACLE 11P |
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10106813-033112LF |
FCI / Amphenol |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:800; 产品类型:Board to Board & Mezzanine Connectors; 绝缘电阻:1000 MOhms; 商标:Amphenol FCI; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:MezzoStak; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:GXT; 最大工作温度:+ 125 C; 最小工作温度:- 40 C; 电流额定值:500 mA; 叠放高度:6.5 mm; 端接类型:SMD/SMT; 节距:0.50 mm; 位置数量:30 Position; 产品:Hermaphroditic Connectors; 制造商:FCI / Amphenol; |
板对板与夹层连接器 30 P Hermaphroditic Mezzanine Connector |
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10106813-034112LF |
FCI / Amphenol |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:800; 产品类型:Board to Board & Mezzanine Connectors; 绝缘电阻:1000 MOhms; 商标:Amphenol FCI; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:MezzoStak; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:GXT; 最大工作温度:+ 125 C; 最小工作温度:- 40 C; 电压额定值:500 V; 电流额定值:500 mA; 叠放高度:7 mm; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.50 mm; 位置数量:30 Position; 产品:Hermaphroditic Connectors; RoHS:Y; 制造商:FCI / Amphenol; |
板对板与夹层连接器 30P MEZZANINE 3.5MM HERMAPHRODITIC |
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DF9B-51S-1V(69) |
Hirose Electric |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1000; 产品类型:Board to Board & Mezzanine Connectors; 商标:Hirose Connector; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:DF9; 外壳材料:Polyamide (PA); 触点材料:Phosphor Copper; 触点电镀:Gold; 电压额定值:150 V; 电流额定值:500 mA; 安装角:Straight; 端接类型:SMD/SMT; 排数:2 Row; 节距:1 mm; 位置数量:51 Position; 产品:Receptacles; RoHS:Y; 制造商:Hirose Electric; |
板对板与夹层连接器 1.0MM V SMT RECPT 9P TIN PLT MTL FIT |
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10106813-044112LF |
FCI / Amphenol |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:800; 产品类型:Board to Board & Mezzanine Connectors; 绝缘电阻:1000 MOhms; 商标:Amphenol FCI; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:MezzoStak; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:GXT; 最大工作温度:+ 125 C; 最小工作温度:- 40 C; 电压额定值:500 V; 电流额定值:500 mA; 叠放高度:5.5 mm; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.50 mm; 位置数量:40 Position; 产品:Hermaphroditic Connectors; RoHS:Y; 制造商:FCI / Amphenol; |
板对板与夹层连接器 40P MEZZANINE 3.5MM HERMAPHRODITIC |
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AXK5F50547YG |
Panasonic |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:2000; 产品类型:Board to Board & Mezzanine Connectors; 商标:Panasonic Industrial Devices; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:P5KF; 外壳材料:Liquid Crystal Polymer (LCP); 触点材料:Copper Alloy; 触点电镀:Gold; 电压额定值:60 V; 电流额定值:500 mA; 安装角:Vertical; 端接类型:SMD/SMT; 节距:0.5 mm; 位置数量:50 Position; 产品:Receptacles; RoHS:E; 制造商:Panasonic; |
板对板与夹层连接器 CONN SOCKET BRD/BRD 50 POS 0.5mm |
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53885-0308 |
Molex |
板对板与夹层连接器 |
商标名:SlimStack; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:3000; 产品类型:Board to Board & Mezzanine Connectors; 商标:Molex; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:53885; 触点材料:Gold; 触点电镀:Gold; 最大工作温度:+ 105 C; 最小工作温度:- 40 C; 电压额定值:50 V; 电流额定值:500 mA; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.5 mm; 位置数量:30 Position; 产品:Receptacles; RoHS:Y; 制造商:Molex; |
板对板与夹层连接器 .5MM VERT PLG 30CKT SMT W/O SOLDER TAB |
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AXK6S60447YG |
Panasonic |
板对板与夹层连接器 |
子类别:Board to Board & Mezzanine Connectors; 标准包装数量:500; 产品类型:Board to Board & Mezzanine Connectors; 商标:Panasonic Industrial Devices; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:P5KS; 外壳材料:Resin; 触点材料:Copper Alloy; 触点电镀:Gold; 电压额定值:60 V; 电流额定值:500 mA; 叠放高度:7 mm; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.5 mm; 位置数量:60 Position; 产品:Headers; RoHS:E; 制造商:Panasonic; |
板对板与夹层连接器 CONN HEADER P5KS 60 POS 0.5mm |
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501591-3011 |
Molex |
板对板与夹层连接器 |
商标名:SlimStack; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:3000; 产品类型:Board to Board & Mezzanine Connectors; 可燃性等级:UL 94 V-0; 商标:Molex; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:501591; 外壳材料:Thermoplastic; 触点材料:Phosphor Bronze; 触点电镀:Gold; 最大工作温度:+ 85 C; 最小工作温度:- 25 C; 电压额定值:50 VAC/DC; 电流额定值:300 mA; 叠放高度:0.9 mm; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.4 mm; 位置数量:30 Position; 产品:Receptacles; RoHS:Y; 制造商:Molex; |
板对板与夹层连接器 .4MM 30P V RECPT .9MM STACK HGHT |
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500913-0502 |
Molex |
板对板与夹层连接器 |
商标名:SlimStack; 子类别:Board to Board & Mezzanine Connectors; 标准包装数量:1500; 产品类型:Board to Board & Mezzanine Connectors; 商标:Molex; 封装:Reel; 封装:MouseReel; 封装:Cut Tape; 系列:500913; 外壳材料:Thermoplastic; 触点材料:Gold; 触点电镀:Gold; 最大工作温度:+ 85 C; 最小工作温度:- 25 C; 电压额定值:50 VAC/DC; 电流额定值:300 mA; 安装角:Vertical; 端接类型:SMD/SMT; 排数:2 Row; 节距:0.4 mm; 位置数量:50 Position; RoHS:Y; 制造商:Molex; |
板对板与夹层连接器 0.4 BtB Rec Hsg Assy ssy 50Ckt EmbsTp Pkg |
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