制造商 | Manufacturer | CUI Devices |
产品 | Product | Heat Sinks |
设计目的 | Designed For | TO-220 |
安装风格 | Mounting Style | PCB |
散热片材料 | Heatsink Material | Aluminum |
热阻 | Thermal Resistance | 23.05 C/W |
长度 | Length | 38.1 mm |
宽度 | Width | 12.8 mm |
高度 | Height | 12.7 mm |
封装 | Packaging | Bulk |
类型 | Type | Stamped Heat Sink |
商标 | Brand | CUI Devices |
高度 – 英寸 | Height_In | - |
高度 – 毫米 | Height_Mm | - |
长度 – 英寸 | Length_In | - |
长度 – 毫米 | Length_Mm | - |
产品类型 | Product Type | Heat Sinks |
标准包装数量 | Standard Pack Qty | 500 |
子类别 | Subcategory | Heat Sinks |
宽度 – 英寸 | Width_In | - |
宽度 – 毫米 | Width_Mm | - |
序号 | 料号 | D/C | 数量 | 品牌 | 每条可出价1次 |
1 | HSR-1 | 0 | CUI Devices | ||
2 | 7148DG | 0 | CUI Devices | ||
3 | AER43-43-21CB/A01 | 0 | CUI Devices | ||
4 | 130-C | 0 | CUI Devices | ||
5 | ATS-54270D-C1-R0 | 0 | CUI Devices | ||
6 | ATS-54300W-C1-R0 | 0 | CUI Devices | ||
7 | 909-37-1-21-2-B-0 | 0 | CUI Devices | ||
8 | ATS-X53330B-C1-R0 | 0 | CUI Devices | ||
9 | 1960050950N001 | 0 | CUI Devices | ||
10 | HS-89M0-F1 | 0 | CUI Devices | ||
11 | TX30547R | 0 | CUI Devices | ||
12 | 214676 | 0 | CUI Devices | ||
13 | DV-T268-101E | 0 | CUI Devices | ||
14 | ATS-53210D-C1-R0 | 0 | CUI Devices | ||
15 | THSF-HL-BL_WT | 0 | CUI Devices | ||
16 | 127733 | 0 | CUI Devices | ||
17 | HS-0842-F1 | 0 | CUI Devices | ||
18 | 30771 | 0 | CUI Devices | ||
19 | 124669 | 0 | CUI Devices | ||
20 | HTS-CBR-BTF | 0 | CUI Devices |