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EDMHSCP12201001
国内现货
今日价格:
价格走势图 >
名称：EDMHSCP12201001
品牌：TechNexion
说明：散热片 EDM COMPACT 12 MM PASSIVE HEATSINK + 20*20 MM THERMOPAD WITH 1.0 MM THICKNESS FOR MAPBGA AND UNLIDDED NXP CPUS + MYLAR
系列：
货期：两周
规格参数
价格走势
| 制造商 | Manufacturer | TechNexion |
| RoHS | Rohs | Y |
| 产品 | Product | Heat Sinks |
| 设计目的 | Designed For | MAPBGA, CPUS + MYLAR |
| 安装风格 | Mounting Style | Screw |
| 长度 | Length | 20 mm |
| 宽度 | Width | 20 mm |
| 高度 | Height | 1 mm |
| 商标 | Brand | TechNexion |
| 产品类型 | Product Type | Heat Sinks |
| 标准包装数量 | Standard Pack Qty | 1 |
| 子类别 | Subcategory | Heat Sinks |
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| 序号 | 料号 | D/C | 数量 | 品牌 | 每条可出价1次 |
| 1 | 2065-75" | 0 | TechNexion | ||
| 2 | ATS-HP-F4L70S41W-192 | 0 | TechNexion | ||
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| 5 | MAX14NG | 0 | TechNexion | ||
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| 7 | THSM-nXBT-B | 0 | TechNexion | ||
| 8 | 133-7.5B9 | 0 | TechNexion | ||
| 9 | 655-53ABT5 | 0 | TechNexion | ||
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| 11 | 38145 | 0 | TechNexion | ||
| 12 | ATS-X53325R-C1-R0 | 0 | TechNexion | ||
| 13 | ATS-HP-F8L500S13W-444 | 0 | TechNexion | ||
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| 18 | 669-33AB | 0 | TechNexion | ||
| 19 | THS-HL-BL | 0 | TechNexion | ||
| 20 | 628-40ABT5 | 0 | TechNexion |
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